Back-side attacks for laser fault injection has advantages over front-side attacks. In visible light, however, the silicon substrate prevents looking at the layout. Without other information to map the layout to the device under test it becomes hard to identify regions of interest. This option for the Diode Laser Station -any other laser cutter system- allows the user to use a infrared sensitive camera and light source to look through the substrate. Easing navigation, the analyst can easily recognize visual markers to find the location of the attack.
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Bartek Gedrojc 大虎
- Sales and Business Development Director Tools