Home BBI probes (RBBI/FBBI)

BBI probes (RBBI/FBBI)



BBI provides a local precision glitch using high power electrical pulses. Using BBI one can overcome some of the issues faced with EM-FI or laser.

  • EM-FI injects a relatively large field of energy, a BBI probe injects faults in a very small location. This way security vulnerabilities can be pinpointed to a more specific location.
  • Most high security chips are nowadays resistant to laser using defensive programming or hardware countermeasures. The fault characteristics of BBI are different from laser, and memory types like EEPROM react differently to this type of fault.
  • Another issue occurs with hardware built in-house. Using off-the-shelf components to build a BBI setup (including high voltage amplifier, transmission cable, needle) the cable distorts the wave shape. We resolved this in our high-end dedicated package.

Key features

Full BBI attack coverage in dedicated package (reverse RBBI / forward FBBI).

Spring-driven needle to avoid damage to the substrate.

Simple to use SMA connector makes EM-FI Transient Probe the perfect match as a pulse and power driver.

High intensity, short pulse.

Inspector software provides a hopping feature to lift probe when moving to next location.

Polishing of the chip not needed.

Inspector integration

Easily connects to the EM-FI Transient Probe as a pulse and power driver. With the integrated support in Inspector for hopping and scanning and spring loaded needle on the probe itself you don’t need to worry about damaging the chip during testing.

Technical specifications

  • High power positive (red): 200V (+- 20%)
  • Low power positive (blue): +33V (+- 20%)
  • High power negative (black): -37V (+- 20%)
  • Low power negative (green): -200V (+- 20%)
  • Contact us
  • Bartek Gedrojc 大虎

  • Sales and Business Development Director Tools